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Supermicro X11SPI-TF Server C622 LGA 3647 ATX Motherboard

Item No:
709733
MPN:
X11SPi-TF
$892.87
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Supermicro X11SPI TF Server Motherboard, ATX, Intel C622, LGA 3647, 1st & 2nd Gen Intel Xeon, 8x DIMM, 2x 10GBe Lan, 2x PCIe x16, 2x PCIe x8
2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors, , Single Socket LGA 3647 (Socket P) supported, CPU TDP support Up to 205W TDP
Intel C622
Up to 2TB 3DS ECC RDIMM, DDR4 2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4 2933MHz, in 8 DIMM slots
Expansion slots:
1 PCI E 3.0 x16,
1 PCI E 3.0 x16 (x16 x8),
1 PCI E 3.0 x8 (x0 x8),
1 PCI E 3.0 x8,
1 PCI E 3.0 x4 (in x8)
2 10GbE LAN ports
10 SATA3 (6Gbps) via C622
I/O: 1 VGA, 2 COM, TPM header
5 USB 3.0 (2 rear, 1 Type A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
M.2 NGFF connector
M.2 Interface: PCI E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M Key
Double Height Connector
Processor
Processor manufacturer The manufacturer that produced the processor. Intel
Processor thermal power (max) 205 W
Memory
Supported memory types Types of memory which can be used with the product. DDR4-SDRAM
Memory voltage The voltage (V) of the memory in the device. 1.2 V
ECC ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Supported memory clock speeds Memory clock speed is the time it takes for a computer to complete basic operations. It refers to the computer's processing speed and is measured in hertz. It is however not such a reliable measure of a computer's speed as it doesn't take into account other factors like RAM and cache size. 1600,1866,2133,2400,2666 MHz
Maximum internal memory The maximum internal memory which is available in the product. 1 TB
Storage controllers
RAID levels RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required. 0, 5, 10
Internal I/O
USB 2.0 connectors The end of a cable with a USB 2.0 connector. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), in addition to the "USB 1.x Full Speed" signaling rate of 12 Mbit/s. USB 2.0 connectors are usually colored black. 6
Rear panel I/O ports
USB 2.0 ports quantity Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black. 6
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 5
VGA (D-Sub) ports quantity Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM. 1
COM ports quantity 2
Network
Ethernet LAN An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Ethernet interface type 10 Gigabit Ethernet
Wi-Fi Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Features
Motherboard form factor Design of the motherboard (ATX, BTX etc). ATX
Expansion slots
PCI Express x16 (Gen 3.x) slots Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard. 1
BIOS
BIOS type The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS. UEFI AMI
ACPI version 6.0
Processor special features
Trusted Platform Module (TPM)
Operational conditions
Storage temperature (T-T) The minimum and maximum temperatures at which the product can be safely stored. -40 - 70 °C
Operating temperature (T-T) The minimum and maximum temperatures at which the product can be safely operated. 0 - 50 °C
Operating relative humidity (H-H) 8 - 90%
Storage relative humidity (H-H) 5 - 95%
Logistics data
Harmonized System (HS) code 84733020
Weight & dimensions
Width The measurement or extent of something from side to side. 304.8 mm
Depth The distance from the front to the back of something. 243.8 mm
Other features
PCI Express x4 (Gen 3.x) slots 1
PCI Express x8 (Gen 3.x) slots Slots in the computer for PCI Express x8 (Gen 3.x), which is a high-speed serial computer expansion bus standard with 8 pins. 1
Supported DIMM module capacities 4GB, 8GB, 16GB, 32GB, 64GB, 128MB
Number of DIMM slots The number of places where DIMMs can be connected. A DIMM or dual in-line memory module comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share. 8
More Information
SKU 709733
MPN X11SPi-TF
Brand Supermicro
Product Condition Brand New/Unused
Case/MB Form Factor ATX
Motherboard Chipset Intel C622
CPU Socket LGA 3647
Memory Type DDR4
Memory Form Factor DIMM
Product Use General
Warranty Period 1 Year Warranty
Warranty Contact https://www.supermicro.com/