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Lenovo ThinkSystem ST550, 2.2 GHz, 4210, 32 GB, DDR4-SDRAM, 750 W, Rack (4U)
Workload-optimized support
New second-generation Intel Xeon Scalable family CPUs offer increased performance of 36% over the previous generation*, support for faster 2933MHz TruDDR4 memory and Intel's Vector Neural Network Instruction (VNNI) which accelerates processor performance for the needs of growing higher data transmitting speed and advanced computing performance. Up to 6% increases in per-core performance and hardware security mitigations round out the enhanced capabilities featured in this next-generation processor technology from Intel.*
* Based on Intel internal testing, August 2018.
Accelerate data insights
ThinkSystem ST550 supports up to two NVIDIA graphic processing unit (GPUs) cards up to 250W. Processing is offloaded to the GPU to maximize computing power and application performance, and the server is optimized to process large blocks of data in parallel. This high-performance parallel computing makes the ST550 ideal for virtualization, VDI, and private cloud.
Flexible storage
Lenovo AnyBay design features a choice of drive interface type in the same drive bay: SAS drives, SATA drives, or U.2 NVMe PCIe drives. Freedom to configure some of the bays with PCIe SSDs and still use the remaining bays for capacity SAS drives provides the ability to upgrade to more PCIe SSDs in the future as needed.
New second-generation Intel Xeon Scalable family CPUs offer increased performance of 36% over the previous generation*, support for faster 2933MHz TruDDR4 memory and Intel's Vector Neural Network Instruction (VNNI) which accelerates processor performance for the needs of growing higher data transmitting speed and advanced computing performance. Up to 6% increases in per-core performance and hardware security mitigations round out the enhanced capabilities featured in this next-generation processor technology from Intel.*
* Based on Intel internal testing, August 2018.
Accelerate data insights
ThinkSystem ST550 supports up to two NVIDIA graphic processing unit (GPUs) cards up to 250W. Processing is offloaded to the GPU to maximize computing power and application performance, and the server is optimized to process large blocks of data in parallel. This high-performance parallel computing makes the ST550 ideal for virtualization, VDI, and private cloud.
Flexible storage
Lenovo AnyBay design features a choice of drive interface type in the same drive bay: SAS drives, SATA drives, or U.2 NVMe PCIe drives. Freedom to configure some of the bays with PCIe SSDs and still use the remaining bays for capacity SAS drives provides the ability to upgrade to more PCIe SSDs in the future as needed.
| Processor | |
| Processor manufacturer The manufacturer that produced the processor. | Intel |
| Processor model The model number for the processor in a computer. | 4210 |
| Processor frequency The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform. | 2.2 GHz |
| Processor boost frequency The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded. | 3.2 GHz |
| Processor family A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors. | Intel Xeon Silver |
| Processor cores The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores). | 10 |
| Processor cache | 13.75 MB |
| Number of processors installed Number of processors in the product. | 1 |
| Thermal Design Power (TDP) | 85 W |
| Processor socket Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering. | LGA 3647 |
| Processor lithography The process which is performed by the processor e.g. CPU (Central Processing Unit). | 14 nm |
| Processor threads | 20 |
| Processor operating modes Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software. | 64-bit |
| Processor codename | Cascade Lake |
| Tcase | 78 °C |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Execute Disable Bit |
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| Maximum number of PCI Express lanes | 48 |
| Processor package size | 76.0 x 56.5 mm |
| Supported instruction sets | AVX-512 |
| Scalability | 2S |
| Embedded options available |
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| Memory | |
| Internal memory A computer's memory which is directly accessible to the CPU. | 32 GB |
| Internal memory type The type of internal memory such as RAM, GDDR5. | DDR4-SDRAM |
| Memory slots Number and type of memory expansion slots, including connector and memory module descriptions. | 12 |
| Memory clock speed The frequency at which the memory (e.g. RAM) runs. | 2933 MHz |
| Memory layout (slots x size) The slots and size of the memory for the CPU. | 1 x 32 GB |
| Storage | |
| Supported HDD sizes The size of the hard disk drives which can be used by the device. | 2.5" |
| RAID support The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required. |
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| RAID levels RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required. | 0,1,5,6,10,50,60 |
| Supported RAID controllers | 930-8i 2GB Flash |
| Hot-swap |
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| Optical drive type An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM. |
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| Graphics | |
| On-board graphics adapter Graphics hardware which is built into the motherboard or CPU, as opposed to a separate graphics adapter (video card). On-board graphics uses CPU and RAM for graphics processing. |
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| On-board graphics adapter model "Graphic adapter" is the hardware that produces images on a display. "On-board" means that the graphics adapter is intergrated inside the motherboard. | Not available |
| Ports & interfaces | |
| Ethernet LAN (RJ-45) ports Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet. | 2 |
| USB 2.0 ports quantity Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black. | 5 |
| USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity | 3 |
| VGA (D-Sub) ports quantity Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM. | 1 |
| Expansion slots | |
| PCI Express slots version | 3.0 |
| Design | |
| Chassis type The type of rigid framework onto which is the hosuing for device components. | Rack (4U) |
| Product colour The colour e.g. red, blue, green, black, white. | Black |
| Rack mounting The type of mounting that can position devices in a shelving system (rack). |
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| Performance | |
| Performance management | XClarity Enterprise |
| Trusted Platform Module (TPM) |
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| Trusted Platform Module (TPM) version | 1.2 |
| Software | |
| Compatible operating systems List of desktop operating systems tested as compatible with this product. | Microsoft Windows Server 2016 Microsoft Windows Server 2019 Red Hat Enterprise Linux 7.6 Red Hat Enterprise Linux 7.7 Red Hat Enterprise Linux 7.8 Red Hat Enterprise Linux 7.9 Red Hat Enterprise Linux 8.0 Red Hat Enterprise Linux 8.1 Red Hat Enterprise Linux 8.2 SUSE Linux Enterprise Server 12 SP4 SUSE Linux Enterprise Server 12 SP5 SUSE Linux Enterprise Server 12 Xen SP4 SUSE Linux Enterprise Server 12 Xen SP5 SUSE Linux Enterprise Server 15 SUSE Linux Enterprise Server 15 SP1 SUSE Linux Enterprise Server 15 SP2 SUSE Linux Enterprise Server 15 Xen SUSE Linux Enterprise Server 15 Xen SP1 SUSE Linux Enterprise Server 15 Xen SP2 VMware ESXi 6.5 U2 VMware ESXi 6.5 U3 VMware ESXi 6.7 U1 VMware ESXi 6.7 U2 VMware ESXi 6.7 U3 VMware ESXi 7.0 VMware ESXi 7.0 U1 |
| Processor special features | |
| Enhanced Intel SpeedStep Technology |
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| Intel Virtualization Technology for Directed I/O (VT-d) <b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other. |
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| Intel® Hyper Threading Technology (Intel® HT Technology) <b>Improved Performance for Threaded Software</b> Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth. |
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| Intel® Turbo Boost Technology <b>Higher Performance When You Need It Most</b> Intel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration. | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) <b>Added Security with Faster Data Encryption</b> The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants. |
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| Intel Trusted Execution Technology |
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| Intel VT-x with Extended Page Tables (EPT) |
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| Intel TSX-NI |
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| Intel 64 |
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| Intel Virtualization Technology (VT-x) <b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other. |
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| Processor ARK ID | 193384 |
| Power | |
| Power supply The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable. | 750 W |
| Redundant power supply (RPS) support Additional power supply which can run a computer if the main power supply fails. |
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| Number of main power supplies The quantity of main power supplies for this product. | 1 |
| Certificates | |
| Energy Star certified This indicates that the product is compliant with Energy Star, which is an international standard for energy-efficient consumer products. |
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| Weight & dimensions | |
| Width The measurement or extent of something from side to side. | 176 mm |
| Depth The distance from the front to the back of something. | 670 mm |
| Height The measurement of the product from head to foot or from base to top. | 438 mm |
| SKU | 428113 |
| MPN | 7X10A0AKAU |
| Brand | Lenovo |
| Product Condition | Brand New/Unused |
| Stock Availability | Available for Shipping |
| Product Use | General |