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This document describes ValueRAM's 512M x 64-bit (4GB) DDR3-1600 CL11 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR3-1600
timing of 11-11-11 at 1.5V. This 240-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
timing of 11-11-11 at 1.5V. This 240-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
FEATURES
- JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 800MHz fCK for 1600Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6
- Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB : Height 1.180” (30.00mm), single sided component
Features | |
CAS latency Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better. | 11 |
Internal memory A computer's memory which is directly accessible to the CPU. | 4 GB |
Memory layout (modules x size) How the overall memory of the product is put together, defined by the number of modules and the size. | 1 x 4 GB |
Internal memory type The type of internal memory such as RAM, GDDR5. | DDR3 |
Memory clock speed The frequency at which the memory (e.g. RAM) runs. | 1600 MHz |
Component for What this product is used as a part of (component for). | PC/server |
Memory form factor Design of the memory e.g. 240-pin DIMM, SO-DIMM. | 240-pin DIMM |
Buffered memory type | Unregistered (unbuffered) |
ECC ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention. | |
Memory bus Hardware and software that connects the main memory to the memory controller in computer systems. Originally, general-purpose buses like VMEbus and the S-100 bus were used, but to reduce latency, modern memory buses are designed to connect directly to DRAM chips, and thus are designed by chip standards bodies such as JEDEC. | 64 bit |
Memory ranking | 1 |
Memory voltage The voltage (V) of the memory in the device. | 1.5 V |
Module configuration | 512M X 64 |
Lead plating | Gold |
Operational conditions | |
Operating temperature (T-T) The minimum and maximum temperatures at which the product can be safely operated. | 0 - 85 °C |
Weight & dimensions | |
Width The measurement or extent of something from side to side. | 133.3 mm |
Other features | |
Chips organisation | X8 |
Bus clock rate | 1600 MHz |
Error indication | |
Rack mounting The type of mounting that can position devices in a shelving system (rack). | 240-pin DIMM |
Memory layout Describes how memory is plugged on the motherboard | 1 x 4096 MB |
Internal memory The amount of memory, usually measured in bytes (e.g. MB, GB), which is installed in the system's hardware. | 4096 MB |
SKU | 217042 |
MPN | KVR16N11S8/4 |
Brand | Kingston |
Product Condition | Brand New/Unused |
Memory Type | DDR3 |
Memory Form Factor | DIMM |
Warranty Period | Limited Lifetime Warranty |
Warranty Contact | https://www.kingston.com/ |