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Kingston FURY Beast 32GB (1x32GB) DDR5-6400 Memory - White

Item No:
844897
MPN:
KF564C32BWE-32
$1,598.75
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Kingston Technology FURY Beast 32GB 6400MT/s DDR5 CL32 DIMM White EXPO, 32 GB, 1 x 32 GB, DDR5, 288-pin DIMM, White
Up to 6800MT/s
Kingston FURY™ Beast DDR5 memory provides superb speed, capacity and reliability for next-gen gaming platforms. Level up your machine's performance with enhanced features like on-die ECC for better stability and dual 32-bit subchannels to boost efficiency. Kingston FURY Beast DDR5 offers overclock specs for Intel® XMP 3.0 and AMD EXPO™ with customisable profiles for speeds and timings to help you wring the most from your gaming experience, livestream at 4K+ or push animation and 3D rendering projects.

Kingston FURY™ Beast DDR5 memory brings the latest, cutting-edge technology for next-gen gaming platforms. Taking speed, capacity and reliability even further, DDR5 arrives with an arsenal of enhanced features, like on-die ECC (ODECC) for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit (PMIC) to provide juice where it's needed most.

Superior speed advancements, with double the banks from 16 to 32 and double the burst length from 8 to 16, take DDR5 memory, your gaming experience and your overall system applications to the next level of performance.
Whether you're pushing the limits in your gaming with the most extreme settings, live streaming at 4K+ or pushing large animation and 3D rendering, Kingston FURY Beast DDR5 memory is the level-up needed, while seamlessly bridging style and unleashing performance.

With options featuring Intel XMP 3.0 or AMD EXPO, two new DDR5 overclock specs that include customisable profiles for speeds and timings, Kingston FURY Beast DDR5 has your compatible overclock solutions covered."

Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain the ultimate performance while you push the limits

Increased efficiency
Boosted by double the banks and burst length and two independent 32-bit subchannels, DDR5's exceptional handling of data shines with the latest games, programs and demanding applications.

Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.

AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.

Qualified by the world's leading motherboard manufacturers*
Tested and approved so you can build and upgrade with confidence on your preferred motherboard.

Low-profile heat spreader
Newly designed heat spreaders in black or white combine bold styling and outstanding cooling functionality.
Features
On-Die ECC Indicates whether the device features integrated Error Correction Code (ECC) to detect and fix single-bit memory errors internally.
CAS latency Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better. 32
Internal memory A computer's memory which is directly accessible to the CPU. 32 GB
Memory layout (modules x size) How the overall memory of the product is put together, defined by the number of modules and the size. 1 x 32 GB
Internal memory type The type of internal memory such as RAM, GDDR5. DDR5
Memory data transfer rate The speed at which data is transferred between the memory and the processor, typically measured in megatransfers per second (MT/s) or megahertz (MHz). 6400 MT/s
Component for What this product is used as a part of (component for). PC
Memory form factor Design of the memory e.g. 240-pin DIMM, SO-DIMM. 288-pin DIMM
ECC ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Buffered memory type The architecture used to manage the data flow between the memory controller and the memory chips, such as Registered (buffered) or Load reduced. Unregistered (unbuffered)
Memory voltage The voltage (V) of the memory in the device. 1.4 V
AMD Extended Profiles for Overclocking (EXPO) Indicates whether the product supports AMD Extended Profiles for Overclocking (EXPO) for optimized memory performance.
AMD Extended Profiles for Overclocking (EXPO) version The version of the AMD Extended Profiles for Overclocking standard supported by the product (e.g. 1.1). 1.0
SPD profile Indicates whether the device includes a Serial Presence Detect (SPD) profile for automatic configuration of memory timings and frequency.
Product colour The colour e.g. red, blue, green, black, white. White
Cooling type The method used to cool the device or to cool the air around the device. Heatsink
Lead plating The type of metal layer applied to the electrical contacts to improve conductivity and prevent corrosion (e.g. Gold). Gold
Backlight Product has a built-in light source for its illuminating.
JEDEC standard Indicates whether the product complies with the Joint Electron Device Engineering Council (JEDEC) industry standards for reliability and performance.
Operational conditions
Operating temperature (T-T) The minimum and maximum temperatures at which the product can be safely operated. 0 - 85 °C
Storage temperature (T-T) The minimum and maximum temperatures at which the product can be safely stored. -55 - 100 °C
Weight & dimensions
Width The measurement or extent of something from side to side. 6.62 mm
Depth The distance from the front to the back of something. 133.3 mm
Height The measurement of the product from head to foot or from base to top. 34.9 mm
Weight Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies. 34.59 g
Packaging data
Package width The distance from one side of the packaging to the other. 57.1 mm
Package depth The distance from the front to the back of the packaging. 14 mm
Package height The distance from the top to the bottom of the packaging. 171.4 mm
Package weight Weight of the packaged product. 54.1 g
Logistics data
Products per master (outer) case The total quantity of individual units contained within a single master shipping case, measured in pc(s). 25 pc(s)
Master (outer) case width The width of the outer shipping container used for bulk transport, measured in mm. 196.8 mm
Master (outer) case length The total length of the external shipping container used for bulk transport, measured in millimetres or centimetres. 311.1 mm
Master (outer) case height The vertical measurement of the external shipping container used for bulk transport, typically expressed in millimetres or centimetres. 61 mm
Master (outer) case gross weight The total weight of the outer shipping container, including all contained products and packaging materials, measured in kilograms or grams. 1.5 kg
Other features
Country of origin Country where the device is made. Aka Country of manufacture (COM). China, Taiwan
More Information
SKU 844897
MPN KF564C32BWE-32
Brand Kingston
Assembled to Order No
Display In Stock In Frontend Yes
Product Condition Brand New/Unused
Product Use General
Warranty Period 3 Years Warranty
Warranty Contact https://www.kingston.com/