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Intel Core i7-7800X
Cores: 6, Threads: 12, Base Frequency: 3.5GHz, Boost Frequency: 4GHz, Cache: 8.25MB, TDP: 140W, Memory Channel: Quad, PCIe Lanes: 28
| Processor | |
| Processor manufacturer The manufacturer that produced the processor. | Intel |
| Processor family A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors. | Intel® Core™ i7 X-series |
| Processor frequency The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform. | 3.5 GHz |
| Processor cores The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores). | 6 |
| Processor socket Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering. | LGA 2066 |
| Component for What this product is used as a part of (component for). | PC |
| Processor lithography The process which is performed by the processor e.g. CPU (Central Processing Unit). | 14 nm |
| Processor series | Intel Core X-series Processors |
| Processor model The model number for the processor in a computer. | i7-7800X |
| Processor threads | 12 |
| System bus rate A bus is a communication system that transfers data between components inside a computer, or between computers. The system bus rate is the speed at which data is transferred in this communication system. | 8 GT/s |
| Processor operating modes Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software. | 64-bit |
| Processor cache | 8.25 MB |
| Processor cache type | L3 |
| Box Plastic or metal shell/container for components. |
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| Cooler included The device comes with an integrated cooler. |
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| Stepping | U0 |
| Processor boost frequency The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded. | 4 GHz |
| Bus type | DMI3 |
| Processor codename | Skylake |
| Generation | 7th Generation |
| Processor code | SR3L4 |
| Processor ARK ID | 123589 |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Quad-channel |
| ECC ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention. |
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| Graphics | |
| On-board graphics adapter Graphics hardware which is built into the motherboard or CPU, as opposed to a separate graphics adapter (video card). On-board graphics uses CPU and RAM for graphics processing. |
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| Power | |
| Thermal Design Power (TDP) | 140 W |
| Features | |
| Execute Disable Bit |
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| Maximum number of PCI Express lanes | 28 |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0,AVX-512,SSE4.1,SSE4.2 |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available |
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| Thermal solution specification Intel Reference Heat Sink specification for proper operation of this SKU. | PCG 2017X |
| PCI Express CEM revision | 3.0 |
| Market segment | DT |
| Harmonized System (HS) code | 8542310001 |
| Processor special features | |
| Intel® Hyper Threading Technology (Intel® HT Technology) <b>Improved Performance for Threaded Software</b> Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth. |
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| Intel® Turbo Boost Technology <b>Higher Performance When You Need It Most</b> Intel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration. | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) <b>Added Security with Faster Data Encryption</b> The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants. |
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| Enhanced Intel SpeedStep Technology |
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| Intel 64 |
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| Intel Virtualization Technology (VT-x) <b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other. |
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| Intel Virtualization Technology for Directed I/O (VT-d) <b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other. |
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| Conflict-Free processor "Conflict free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. |
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| Intel® Optane™ Memory Ready |
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| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Virtual Reality (VR) ready |
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| Operational conditions | |
| Tjunction | 100 °C |
| Technical details | |
| Born on date | Q2'17 |
| Bus bandwidth | 8 |
| Bus type units | GT/s |
| Launch date | Q2'17 |
| Processor cache | 8448 KB |
| Product type The sub-category of the product. | Processor |
| Status | Discontinued |
| Maximum memory | 128 GB |
| Processor brand name | Intel Core i7 X-series Intel Core i7 X-series processor |
| Supported memory types Types of memory which can be used with the product. | DDR4-2400 |
| Last change | 63903513 |
| Product family | Intel Core Processors |
| Bus speed | 8 GT/s |
| Weight & dimensions | |
| Package width The distance from one side of the packaging to the other. | 44 mm |
| Package depth The distance from the front to the back of the packaging. | 116 mm |
| Package height The distance from the top to the bottom of the packaging. | 101 mm |
| Package weight Weight of the packaged product. | 100 g |
| Other features | |
| Maximum internal memory The maximum amount of memory inside a product, usually measured in bytes e.g megabytes (MB) or gigabytes (GB). | 131072 MB |
| SKU | 225995 |
| MPN | BX80673I77800X |
| Brand | Intel |
| Product Condition | Brand New/Unused |