Dell R550 4309Y 16GB 600GB SAS H355 2X800W Server

Processor
Processor manufacturer The manufacturer that produced the processor.	Intel
Processor family A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.	Intel Xeon Silver
Processor generation	3rd Generation Intel® Xeon® Scalable
Processor model The model number for the processor in a computer.	4310
Processor frequency The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.	2.1 GHz
Processor boost frequency The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.	3.3 GHz
Processor cores The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).	12
Processor cache	18 MB
Number of processors installed Number of processors in the product.	1
Maximum internal memory supported by processor	512 GB

Memory
Internal memory A computer's memory which is directly accessible to the CPU.	16 GB
Internal memory type The type of internal memory such as RAM, GDDR5.	DDR4-SDRAM
Buffered memory type	Registered (buffered)
Memory ranking	2
Memory slots Number and type of memory expansion slots, including connector and memory module descriptions.	16x DIMM
Memory layout (slots x size) The slots and size of the memory for the CPU.	1 x 16 GB
Memory data transfer rate	3200 MT/s
Maximum internal memory The maximum internal memory which is available in the product.	1 TB

Storage
Total storage capacity The total amount of data that can be stored on the device.	960 GB
Number of SSDs installed	1
SSD capacity The Solid State Drive's data storage capacity.	960 GB
SSD interface The type of interface(s) with which the Solid State Drive is connected to other hardware.	SATA
SSD size	2.5"
Supported SSD sizes	3.5"
Number of SSDs supported	8
Supported RAID controllers	PERC H755
Hot-Plug support Device has hot-plug capability, which means that user can replace system components without shutting down the system.
Optical drive type An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.

Network
LAN controller	Broadcom 57412
Ethernet LAN An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Ethernet interface type	10 Gigabit Ethernet

Ports & interfaces
Ethernet LAN (RJ-45) ports Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.	2
USB 2.0 ports quantity Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	1
VGA (D-Sub) ports quantity Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.	2

Expansion slots
PCI Express x8 (Gen 3.x) slots Slots in the computer for PCI Express x8 (Gen 3.x), which is a high-speed serial computer expansion bus standard with 8 pins.	1
PCI Express x16 (Gen 3.x) slots Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard.	1

Design
Chassis type The type of rigid framework onto which is the hosuing for device components.	Rack (2U)
Product colour The colour e.g. red, blue, green, black, white.	Black
Rack rails
Bezel

Performance
Remote administration	iDRAC9 Enterprise 15G

Software
Operating system installed Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.
Compatible operating systems List of desktop operating systems tested as compatible with this product.	Canonical Ubuntu Server LTS Citrix Hypervisor Microsoft Windows Server with Hyper-V Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware ESXi

Power
Redundant power supply (RPS) support Additional power supply which can run a computer if the main power supply fails.
Power supply The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.	800 W
Number of redundant power supplies supported	2
Number of redundant power supplies installed	2
Power cable length	2 m
Power cable connector 1	C13 coupler
Power cable connector 2	C14 coupler
Power cable current	10 A

Operational conditions
Operating temperature (T-T) The minimum and maximum temperatures at which the product can be safely operated.	10 - 35 °C
Storage temperature (T-T) The minimum and maximum temperatures at which the product can be safely stored.	-40 - 65 °C
Operating relative humidity (H-H)	8 - 80%
Storage relative humidity (H-H)	5 - 95%
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 12000 m

Carbon footprint
Total carbon footprint (kg of CO2e) The total mean carbon footprint value generated across various lifecycle stages (manufacturing, transportation / logistics, use and end of life) per unit (for one single product) i.e., measured in kilograms CO2e.	8790
Total carbon emissions, standard deviation (kg of CO2e) The total estimated standard deviation of carbon emission calculated over various lifecycle stages per unit i.e., measured in kilograms CO2e. Deviations can be caused due to the use of default, assumed values during calculations.	4760
Carbon emissions, manufacturing (kg of CO2e) The mean carbon emissions during the Manufacturing stage (i.e., emissions during raw material extraction and manufacturing of components (e.g., drives, graphics cards, memory, CPU, mainboards, etc.) or assembling of the product.	1018
Carbon emissions, logistics (kg of CO2e) The mean carbon emissions during the transportation of the product.	162
Carbon emissions, energy usage (kg of CO2e) Use-phase carbon emissions from products that consume energy (fuels or electricity) during use.	7580
Carbon emissions, end-of-life (kg of CO2e) The mean carbon emissions related to the End-of-Life processing of products.	26
Total carbon emissions, w/o use phase (kg of CO2e) This is the total Carbon emissions minus the Use of product related emissions i.e., emissions across Manufacturing, Transportation and EOL only.	1206
PAIA version PAIA (Product Attribute to Impact Algorithm) tool for product carbon footprint calculations. The version of the PAIA tool (and year if available) used during carbon footprint calculation for a product.	1.3.2, 2022

Other features
Data transfer rate Rate at which data can be transferred. Usually expressed in units per second. May vary with network configurations.	12 Gbit/s