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- Intel LGA 2066 socket: Ready for the latest Intel® Core™ X-series processors
- AI Overclocking: Quickly optimizes CPU performance by profiling the CPU and cooler, achieving results that are extremely close to manual tuning by experts
- Dual Intel® 2.5G LAN: Offers increased data throughput and improved efficiency, making it ideal for large file transfers and backup
- Fits up to 4-way graphics cards: Includes 7 PCIe Gen 3 x16 slots and supports NVIDIA® SLI and AMD CrossFire™
- Ultra-efficient VRM heatsink: Metal-fin-array design maximizes surface area for heat dissipation to enable unthrottled performance
- Next-gen connectivity: Next-gen transfer speedswith dual M.2, triple U.2 and USB 3.2 Gen 2 Type-A and Type-C™
- AI Overclocking: Quickly optimizes CPU performance by profiling the CPU and cooler, achieving results that are extremely close to manual tuning by experts
- Dual Intel® 2.5G LAN: Offers increased data throughput and improved efficiency, making it ideal for large file transfers and backup
- Fits up to 4-way graphics cards: Includes 7 PCIe Gen 3 x16 slots and supports NVIDIA® SLI and AMD CrossFire™
- Ultra-efficient VRM heatsink: Metal-fin-array design maximizes surface area for heat dissipation to enable unthrottled performance
- Next-gen connectivity: Next-gen transfer speedswith dual M.2, triple U.2 and USB 3.2 Gen 2 Type-A and Type-C™
ASUS PRO WS X299 SAGE II Intel CEB motherboard LGA 2066 for Intel Core X-series processors, with AI Overclocking, dual Intel 2.5G Ethernet, 7 PCIe Gen 3 slots, DDR4 4266 MHz memory support, dual M.2, triple U.2, USB 3.2 Gen 2 Type-C and Aura Sync RGB lighting
Intel LGA 2066 socket: Ready for the latest Intel Core X-series processors
AI Overclocking: Quickly optimizes CPU performance by profiling the CPU and cooler, achieving results that are extremely close to manual tuning by experts
Dual Intel 2.5G LAN: Offers increased data throughput and improved efficiency, making it ideal for large file transfers and backup
Fits up to 4-way graphics cards: Includes 7 PCIe Gen 3 x16 slots and supports NVIDIA SLI and AMD CrossFire
Ultra-efficient VRM heatsink: Metal-fin-array design maximizes surface area for heat dissipation to enable unthrottled performance
Next-gen connectivity: Next-gen transfer speedswith dual M.2, triple U.2 and USB 3.2 Gen 2 Type-A and Type-C
CEB Form Factor ( 30.5 cm x 26.7 cm )
Weight Color Box(3-in-1)
Net Weight: 5.55kg
Gross Weight: 8.06kg
Intel LGA 2066 socket: Ready for the latest Intel Core X-series processors
AI Overclocking: Quickly optimizes CPU performance by profiling the CPU and cooler, achieving results that are extremely close to manual tuning by experts
Dual Intel 2.5G LAN: Offers increased data throughput and improved efficiency, making it ideal for large file transfers and backup
Fits up to 4-way graphics cards: Includes 7 PCIe Gen 3 x16 slots and supports NVIDIA SLI and AMD CrossFire
Ultra-efficient VRM heatsink: Metal-fin-array design maximizes surface area for heat dissipation to enable unthrottled performance
Next-gen connectivity: Next-gen transfer speedswith dual M.2, triple U.2 and USB 3.2 Gen 2 Type-A and Type-C
CEB Form Factor ( 30.5 cm x 26.7 cm )
Weight Color Box(3-in-1)
Net Weight: 5.55kg
Gross Weight: 8.06kg
| Processor | |
| Processor manufacturer The manufacturer that produced the processor. | Intel |
| Processor socket Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering. | LGA 2066 (Socket R4) |
| Compatible processor series A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'. | Intel® Core™ X-series |
| Processor number of cores supported The quantity of processor cores which can be used in the device. | 6,8,10,12,14,16,18 |
| Memory | |
| Supported memory types Types of memory which can be used with the product. | DDR4-SDRAM |
| Non-ECC |
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| Supported memory clock speeds Memory clock speed is the time it takes for a computer to complete basic operations. It refers to the computer's processing speed and is measured in hertz. It is however not such a reliable measure of a computer's speed as it doesn't take into account other factors like RAM and cache size. | 2400,2666,2933,3600,4000,4133,4200,4266 MHz |
| Maximum internal memory The maximum internal memory which is available in the product. | 256 GB |
| Unbuffered memory |
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| Storage controllers | |
| Supported storage drive interfaces | SATA |
| RAID support The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required. |
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| RAID levels RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required. | 0,1,5,10 |
| Graphics | |
| Parallel processing technology support Parallel processing technology is the simultaneous use of more than one CPU or processor core to execute a program or multiple computational threads. Ideally, parallel processing makes programs run faster because there are more engines (CPUs or Cores) running it. In practice, it is often difficult to divide a program in such a way that separate CPUs or cores can execute different portions without interfering with each other. Most computers have just one CPU, but some models have several, and multi-core processor chips are becoming the norm. There are even computers with thousands of CPUs. | 4-Way CrossFireX,4-Way SLI |
| Internal I/O | |
| USB 3.2 Gen 1 (3.1 Gen 1) connectors This is a connector (normally attached to a cable) for USB 3.0. USB 3.0 is the second major revision of the Universal Serial Bus (USB) standard for computer connectivity. First introduced in 2008, USB 3.0 adds a new transfer mode called "SuperSpeed," (distinguishable from USB 2.0 by either the blue colour of the port or the initials SS) capable of transferring data at up to 5Gbit/s—more than ten times as fast as the 480 Mbit/s top speed of USB 2.0. | 1 |
| USB 3.2 Gen 2 (3.1 Gen 2) connectors | 1 |
| Number of SATA III connectors Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface. | 8 |
| ATX Power connector (24-pin) |
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| CPU fan connector |
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| Number of chassis fan connectors | 2 |
| EPS power connector (8-pin) |
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| Number of COM connectors | 1 |
| TPM connector |
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| Rear panel I/O ports | |
| USB 2.0 ports quantity Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black. | 4 |
| USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity | 6 |
| USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity | 1 |
| USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity Number of USB 3.1 (3.1 Gen 2) ports with Type-C connector. USB 3.1 (3.1 Gen 2) is USB interface version which supports transfer rate up to 10 Gbit/s (SuperSpeed+). USB Type-C connector has symmetrical design architecture and compatible with Thunderbolt 3 interface. | 1 |
| Ethernet LAN (RJ-45) ports Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet. | 2 |
| Headphone outputs Number of sockets /ports where headphones are connected. | 1 |
| Network | |
| Ethernet LAN An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable. |
|
| Ethernet interface type | 2.5 Gigabit Ethernet |
| LAN controller | Intel I225-LM |
| Wi-Fi Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves. |
 |
| Features | |
| Motherboard chipset The chipset connects the microprocessor to the rest of the motherboard. | Intel® X299 |
| Audio output channels An audio output channel is an electric circuit which acts as a path for a signal produced by a device. A device may have several audio output channels. | 7.1 channels |
| Component for What this product is used as a part of (component for). | Workstation |
| Motherboard form factor Design of the motherboard (ATX, BTX etc). | CEB |
| Compatible operating systems List of desktop operating systems tested as compatible with this product. | Windows 10 64-bit |
| Expansion slots | |
| PCI Express x16 (Gen 3.x) slots Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard. | 7 |
| Number of M.2 (M) slots | 2 |
| BIOS | |
| Clear CMOS button |
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| Processor special features | |
| Trusted Platform Module (TPM) |
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| Operational conditions | |
| Storage temperature (T-T) The minimum and maximum temperatures at which the product can be safely stored. | -40 - 70 °C |
| Operating temperature (T-T) The minimum and maximum temperatures at which the product can be safely operated. | 10 - 35 °C |
| Storage relative humidity (H-H) | 20 - 90% |
| Weight & dimensions | |
| Width The measurement or extent of something from side to side. | 305 mm |
| Depth The distance from the front to the back of something. | 267 mm |
| Packaging content | |
| Cables included | SATA |
| Other features | |
| Number of DIMM slots The number of places where DIMMs can be connected. A DIMM or dual in-line memory module comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share. | 8 |
| Number of processors supported The quantity of processors which can be used by the product. | 1 |
| SKU | 540734 |
| MPN | PRO WS X299 SAGE II |
| Brand | Asus |
| Product Condition | Brand New/Unused |
| Case/MB Form Factor | CEB |
| Motherboard Chipset | Intel X299 |
| CPU Socket | LGA 2066 |
| Memory Type | DDR4 |
| Memory Form Factor | DIMM |
| Product Use | General |
| Warranty Period | 3 Years Warranty |
| Warranty Contact | https://www.asus.com/ |