Shipping Information
- Available for shipping
- Usually leaves our partner warehouse in 3-5 business days
Store Availability
- 4-6 business days at Bankstown Store
- 4-6 business days at Castle Hill Store
- 3-5 business days at Northmead Store
Shipping Estimate
LANCER BLADE DDR5
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
RGB Your Way
Set the RGB lighting the way you want it. Choose from different effects (static, breathing, and comet) or sync the lights with your favorite jams via Music Mode. All this can be done through RGB control software from all the major motherboard brands.
Create Personalized Lightshow with XPG Prime
XPG Prime lighting control software not only allows you to set unique DRAM lighting effects, you can also sync all Prime supported XPG RGB products to create imaginative light shows and shape your own Prime ecosystem.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
RGB Your Way
Set the RGB lighting the way you want it. Choose from different effects (static, breathing, and comet) or sync the lights with your favorite jams via Music Mode. All this can be done through RGB control software from all the major motherboard brands.
Create Personalized Lightshow with XPG Prime
XPG Prime lighting control software not only allows you to set unique DRAM lighting effects, you can also sync all Prime supported XPG RGB products to create imaginative light shows and shape your own Prime ecosystem.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
Features | |
Buffered memory type | Unregistered (unbuffered) |
On-Die ECC |
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CAS latency Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better. | 36 |
Internal memory A computer's memory which is directly accessible to the CPU. | 32 GB |
Memory layout (modules x size) How the overall memory of the product is put together, defined by the number of modules and the size. | 2 x 16 GB |
Internal memory type The type of internal memory such as RAM, GDDR5. | DDR5 |
Memory clock speed The frequency at which the memory (e.g. RAM) runs. | 6000 MHz |
Component for What this product is used as a part of (component for). | PC |
Memory form factor Design of the memory e.g. 240-pin DIMM, SO-DIMM. | 288-pin DIMM |
ECC ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention. |
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Memory voltage The voltage (V) of the memory in the device. | 1.1,1.4 V |
Intel Extreme Memory Profile (XMP) |
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Intel Extreme Memory Profile (XMP) version | 3.0 |
AMD Extended Profiles for Overclocking (EXPO) |
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Product colour The colour e.g. red, blue, green, black, white. | Black |
Cooling type The method used to cool the device or to cool the air around the device. | Heatsink |
Operational conditions | |
Operating temperature (T-T) The minimum and maximum temperatures at which the product can be safely operated. | 0 - 85 °C |
Storage temperature (T-T) The minimum and maximum temperatures at which the product can be safely stored. | -20 - 65 °C |
Weight & dimensions | |
Width The measurement or extent of something from side to side. | 40 mm |
Depth The distance from the front to the back of something. | 133.3 mm |
Height The measurement of the product from head to foot or from base to top. | 7.86 mm |
Weight Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies. | 41.11 g |
Packaging data | |
Package width The distance from one side of the packaging to the other. | 141 mm |
Package depth The distance from the front to the back of the packaging. | 170 mm |
Package height The distance from the top to the bottom of the packaging. | 12.2 mm |
Package weight Weight of the packaged product. | 122.91 g |
Package type The type of product package e.g. box. | Blister |
SKU | 817170 |
MPN | AX5U6000C3616G-DTLABRBK |
Brand | ADATA |
Product Condition | Brand New/Unused |
Memory Type | DDR5 |
Memory Form Factor | DIMM |
Stock Availability | Available for Shipping |
Product Use | General |
Product Features | RGB |
Warranty Period | 1 Year Warranty |
Warranty Contact | https://www.adata.com/ |