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Kingston 4GB DDR3 1600Mhz DIMM Memory

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PC3L-12800, CL11, 240-Pin, 1.35V-1.5V

KVR16LN11/4 4GB 1Rx8 512M x 64-Bit PC3L-12800 CL11 240-Pin DIMM

DESCRIPTION This document describes ValueRAM's 512M x 64-bit (4GB) DDR3L-1600 CL11 SDRAM (Synchronous DRAM), 1Rx8, low voltage, memory module, based on eight 512M x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.35V or 1.5V. This 240-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:


 • JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power Supply

• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)

 • 800MHz fCK for 1600Mb/sec/pin

• 8 independent internal bank

 • Programmable CAS Latency: 11, 10, 9, 8, 7, 6

 • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]

 • Bi-directional Differential Data Strobe

 • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)

 • On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C

 • Asynchronous Reset

 • PCB Height: 0.740” (18.75mm) or 1.180” (30.00mm), single sided component


 CL(IDD): 11 cycles

 Row Cycle Time: (tRCmin) 48.125ns (min.)

 Refresh to Active/Refresh: 260ns (min.)

Command Time (tRFCmin)

 Row Active Time (tRASmin): 35ns (min.)

Maximum Operating Power: (1.35V) = 2.160 W*

UL Rating: 94 V - 0

Operating Temperature: 0o C to 85o C

Storage Temperature: -55o C to +100o C


CAS latency Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
Internal memory A computer's memory which is directly accessible to the CPU.
4 GB
Memory layout (modules x size) How the overall memory of the product is put together, defined by the number of modules and the size.
1 x 4 GB
Internal memory type The type of internal memory such as RAM, GDDR5.
Memory clock speed The frequency at which the memory (e.g. RAM) runs.
1600 MHz
Component for What this product is used as a part of (component for).
Memory form factor Design of the memory e.g. 240-pin DIMM, SO-DIMM.
240-pin DIMM
Buffered memory type
Unregistered (unbuffered)
ECC ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Memory bus Hardware and software that connects the main memory to the memory controller in computer systems. Originally, general-purpose buses like VMEbus and the S-100 bus were used, but to reduce latency, modern memory buses are designed to connect directly to DRAM chips, and thus are designed by chip standards bodies such as JEDEC.
64 bit
Memory voltage The voltage (V) of the memory in the device.
1.35 V
Module configuration
512M x 64
Memory type Type of memory in the device e.g. DDR3, SRAM (Static RAM).
Product colour The colour e.g. red, blue, green, black, white.
Lead plating

Weight & dimensions

Width The measurement or extent of something from side to side.
133.3 mm

Packaging data

Package type The type of product package e.g. box.

Other features

Chips organisation
Number of pins
Bus clock rate
1600 MHz
Error indication
Rack mounting The type of mounting that can position devices in a shelving system (rack).
240-pin DIMM
Memory layout Describes how memory is plugged on the motherboard
1 x 4096 MB
Internal memory The amount of memory, usually measured in bytes (e.g. MB, GB), which is installed in the system's hardware.
4096 MB
SKU 217035
Brand Kingston
Product Condition Brand New/Unused
Memory Type DDR3
Memory Form Factor DIMM
Stock Availability Available for Shipping