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Cooler Master V SFX Series 750W 80+ Gold Fully Modular Power Supply

Item No:
403207
MPN:
MPY-7501-SFHAGV-AU
$186.95 Was $199
Delivery: Pre-order ETA 03/12/21
Pickup: Check availability
Payment options
Includes SFX to ATX Bracket - 80 PLUS Gold Certification - Fully Modular Cabling - Quiet 92mm FDB Fan - Active PFC - Dimensions: 100 x 125 x 63.5mm - Input Voltage: 90 ~ 264V - Input Current: 10 ~ 5A - Input Frequency: 47 ~ 63 Hz - Operating Temp: 0 ~ 50°C - MTBF: > 100,000 Hours - OVP/OPP/SCP/OCP/UVP/OTP/ Surge & Inrush Protection

Power

Total power The total power that is needed by the device, or the total power produced by the device.
750 W
AC input voltage The voltage of the AC electricity that is inputted into the product.
90 - 264 V
AC input frequency
47 - 63 Hz
Input current
5 - 10 A
Power Factor Correction (PFC) type
Active
Combined power (+3.3V)
120 W
Combined power (+12V)
750 W
Combined power (+5V)
120 W
Combined power (-12V)
3.6 W
Combined power (+5Vsb)
15 W
Max output current (+3.3V)
20 A
Max output current (+12V)
62.5 A
Max output current (+5V)
20 A
Max output current (-12V)
0.3 A
Max output current (+5Vsb)
3 A
Hold time
16 ms
Efficiency
90%
Power Good signal delay range
100 - 500 ms
Power protection features Features that protect the device against power problems e.g. overload.
Over current, Over power, Over voltage, Overheating, Short circuit, Under voltage

Ports & interfaces

Motherboard power connector The way in which the motherboard is connected to the power supply.
20+4 pin ATX
Number of SATA power connectors
8
Peripheral (Molex) power connectors (4-pin) White 4-pinned connector used to connect a peripheral to the power supply.
4
EPS power connector (8-pin)
EPS power connector (4+4 pin)
PCI Express power connectors (6+2 pin)
4
Cabling type
Modular

Performance

80 PLUS certification
80 PLUS Gold
Purpose What the product is used for.
PC/server
Power supply unit (PSU) form factor
SFX
ATX version ATX (Advanced Technology eXtended) is a motherboard form factor specification developed by Intel in 1995. The specification defines the key mechanical dimensions, mounting point, I/O panel, power and connector interfaces between a computer case, a motherboard and a power supply. There are many versions of ATX including ATX12V 1.x and ATX12V v2.3.
3.42
Bearing technology
FDB
Mean time between failures (MTBF) Statistical model used to indicate product/mechanism reliability; expressed in hours and percentage of duty cycle. This number (in hours) does not indicate the mean time before failure for a single unit/mechanism.
100000 h
Certification
ErP 2014 Lot 3, TUV, cTUVus, CE, BSMI, FCC, CCC, EAC, RCM, KCC, CB

Design

Product colour The colour e.g. red, blue, green, black, white.
Black
Cooling type The method used to cool the device or to cool the air around the device.
Active
Fan diameter The size of the fan, measured by the distance from one side of the fan to the other, via a straight line going through the middle of the fan.
9.2 cm

Operational conditions

Operating temperature (T-T) The minimum and maximum temperatures at which the product can be safely operated.
0 - 50 °C

Weight & dimensions

Width The measurement or extent of something from side to side.
125 mm
Depth The distance from the front to the back of something.
100 mm
Height The measurement of the product from head to foot or from base to top.
63.5 mm
Weight Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
1.76 kg

Packaging data

Case or master carton dimensions (W x D x H)
520 x 275 x 215 mm
Case or master carton quantity Quantity of a single product contained within a case or master carton. This is for product contain in the smaller master carton configuration if there is more than one. For example; if there is a 24 unit and a 48 unit MC; this would be the quantity of units in the 24 unit MC
5 pc(s)
Package width The distance from one side of the packaging to the other.
260 mm
Package depth The distance from the front to the back of the packaging.
190 mm
Package height The distance from the top to the bottom of the packaging.
100 mm
Package weight Weight of the packaged product.
2.06 kg

Logistics data

Quantity per pallet layer
24 pc(s)
Specifications
SKU 403207
MPN MPY-7501-SFHAGV-AU
Brand Coolermaster
Product Condition Brand New/Unused
PSU Form Factor SFX / SFX-L