ADATA XPG SX7000 256GB M.2 Gen3x4 SSD
Delivery: Dispatch 1-2 days
Store Pickup: Check Availability
Ultra-fast PCIe Gen3x4 interface:R/W speed up to 1800/850MB/s,NVMe 1.2 certified ,3D NAND Flash,Compact M.2 2280 form factor
ADATA 256GB XPG SX7000 M.2 Gen3x4 SSD - Ultra-fast PCIe Gen3x4 interface:R/W speed up to 1800/850MB/s,NVMe 1.2 certified ,3D NAND Flash,Compact M.2 2280 form factor
Interface Interface ports to connect pieces of equipment. USB (Universal Serial Bus) has become the most popular wired interface to connect peripherals. USB 2.0 supports speeds up to 480 Mbit/s (USB 1: 12 Mbit/s). The interface FireWire is also known as the IEEE 1394 standard. Enhanced IDE (EIDE)is sometimes referred to as Fast ATA, Fast IDE or ATA-2.
PCI Express 3.0
NVMe NVM Express (NVMe) or Non-Volatile Memory Host Controller Interface Specification (NVMHCIS) is an open logical device interface specification for accessing non-volatile storage media attached via a PCI Express (PCIe) bus. NVM Express, as a logical device interface, has been designed to capitalize on the low latency and internal parallelism of solid-state storage devices.
PCI Express interface data lanes
RAID support The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
ECC ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
Mean time between failures (MTBF) Statistical model used to indicate product/mechanism reliability; expressed in hours and percentage of duty cycle. This number (in hours) does not indicate the mean time before failure for a single unit/mechanism.
RoHS compliance The Restriction of Hazardous Substances (RoHS) Directive aims to restrict certain dangerous substances commonly used in electrical and electronic equipment. Any RoHS compliant product is tested for the presence of Lead (Pb), Cadmium (Cd), Mercury (Hg), Hexavalent chromium (Hex-Cr), Polybrominated biphenyls (PBB), and Polybrominated diphenyl ethers (PBDE). PBB and PBDE are flame retardants used in several plastics. For Cadmium and Hexavalent chromium, there must be less than 0.01% of the substance by weight at raw homogeneous materials level. For Lead, PBB, and PBDE, there must be no more than 0.1% of the material, when calculated by weight at raw homogeneous materials. Any RoHS compliant component must have 100 ppm or less of mercury and the mercury must not have been intentionally added to the component. In the EU, some military and medical equipment are exempt from RoHS compliance.
CE, FCC, BSMI, VCCI, KC
Operating temperature (T-T) The minimum and maximum temperatures at which the product can be safely operated.
0 - 70 °C
Weight & dimensions
|Product Condition||Brand New/Unused|
|Drive Form Factor||M.2|
|Connection Interface||M.2 SATA|
|Stock Availability||Available for Shipping, In Stock at Warehouse|
|Product Use||Gaming, Business|